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貝格斯 Gap Filler 1100SF

特點和好處

導熱系數：1.1 W/m

無硅放氣或提取

超協調，專為脆性和低應力的應用

環境和加速治療時間表

100%固體物，無固化副產物

        間隙填充1100sf是硅敏感應用的熱溶液。材料為兩部分組成在室溫或高溫下固化。該材料具有低模量的性能，然后固化軟，彈性彈性體，有助于減少熱循環應力在操作過程中，幾乎消除應力在低應力應用程序。
        兩部件彩色協助為混合指示劑（體積比1:1）。混合系統將在室溫下固化。與固化的熱墊材料，液體的方法提供了無限的厚度變化不大或無應力在裝配位移。間隙填充1100sf，雖然表現出一定的天然粘性特征，不用于熱界面的應用需要一個機械結構鍵。

應用:

        間隙填充1100sf可以混合和分配使用雙筒筒包與靜態混合器和手動或氣動槍或高容量的混合和分配設備（加熱可以降低粘度）

Temperature Dependence of Viscosity

The viscosity of the Gap Filler 1100SF material is temperature dependent. The table below provides the multiplication factor to obtain viscosity at various temperatures. To obtain the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25°C.

Temperature	Multiplication Factor
°C	Part A	Part B
20	1.43	1.57
25	1.00	1.00
35	0.58	0.50
45	0.39	0.30
50	0.32	0.24

性能：

配置可用

• 提供產品或套件的形式

 

 

Typical Properties of Gap Filler 1100 SF
Property	Imperial Value	Metric Value	Test Method
Color / Part A	Yellow	Yellow	Visual
Color / Part B	Red	Red	Visual
Viscosity as Mixed (cps) (1)	450,000	450,000	ASTM D2196
Density (g/cc)	2.0	2.0	ASTM D792
Mix Ratio	1:1	1:1	***
Shelf Life @ 25oC (months)	6	6	***
Property As Cured
Color	Orange	Orange	Visual
Hardness (Shore 00) (2)	60	60	ASTM D2240
Heat Capacity (J/g-K)	0.9	0.9	ASTM E1269
Continuous Use Temp (°F) / (°C)	-76 to 257	-60 to 125	***
Electrical
Dielectric Strength (V/mil)	400	400	ASTM D149
Dielectric Constant (1000 Hz)	5.0	5.0	ASTM D150
Volume Resistivity (Ohm-meter)	1010	1010	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
Thermal As Cured
Thermal Conductivity (W/m-K)	1.1	1.1	ASTM D5470
CURE SCHEDULE
Pot Life @ 25oC (min) (3)	240 min (4 hr)	240 min (4 hr)	***
Cure @ 25oC (hours) (4)	24	24	***
Cure @ 100oC (min) (4)	10	10	***
1)  Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25°C 2)  Thirty second delay value Shore 00 hardness scale 3)  Time for viscosity to double 4)  Cure schedule (rheometer - time to read 90% cure)