貝格斯 Bond-Ply LMS-HD
點和優點
導熱系數：1.4W
墊片材料厚度：0.254mm/0.305mm
阻燃等級：V-O
連續使用溫度：-60℃+180℃
特殊的介電強度
非常低的界面電阻
消除機械緊固件
Bond-Ply LMS-HD導熱 熱固性層壓材料。產品 由高性能熱 導電低模量有機硅化合物 涂層在固化的核心，雙內襯 保護膜。
低模量硅酮 設計有效吸收機械應力 裝配水平的CTE失配引起的沖擊和振動， 同時提供卓越的 熱性能（與PSA技術）和 長期誠信。
Bond-Ply LMS-HD將 通常被用于結構動力 秉承 組件和印刷電路板的散熱片。
典型的應用包括：離散半導體封裝粘結到散熱器或散熱片
性能：配置可用
軋輥形式
切件
表格形式
保質期：粘結層lms-hd是熱固化材料，應存放在溫度控制的條件。建議儲存溫度范圍為5-25°C應該用來維持5個月保質期的最佳特性。
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Property
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Imperial Value
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Metric Value
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Test Method
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Color
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Yellow
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Yellow
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Visual
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Reinforcement Carrier
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Fiberglass
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Fiberglass
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***
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Thickness (inch) / (mm)
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0.010, 0.012
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0.254, 0.305
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ASTM D374
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Continuous Use Temp (°C) / (°F)
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-76 to 356
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-60 to 180
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***
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Adhesion
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Lap Shear @ RT (psi) / (MPa) (1)
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200
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1.4
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ASTM D1002
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Electrical
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Value
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Test Method
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Breakdown Voltage, Sheet (Vac) (1)
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5000
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ASTM D149
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Breakdown Voltage, Laminated (Vac) (2)
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4000
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ASTM D149
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Dielectric Constant (1000 Hz)
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5.0
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ASTM D150
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Volume Resistivity (Ohm-meter)
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1011
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ASTM D257
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Flame Rating
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V-O
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U.L. 94
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Thermal
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Post-Cured Thermal Conductivity (W/m-K) (3)
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1.4
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ASTM D5470
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Thermal Performance vs Lamination Method
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Lamination Pressure (75 psi) (4)
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Constant
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IPO
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TO-220 Thermal Performance (°C/W)
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2.1
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2.3
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1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle.
2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination application.
3) The ASTM D5470 (Henkel Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only.
4) TO-220 Thermal Performance testing, per The Henkel RD2010 specification for Laminates, was completed on laminated TO- 220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing.
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