貝格斯 Bond-Ply 800
導(dǎo)熱系數(shù)：0.8W
熱阻抗：0.6℃-in2/W(@50psi)
墊片材料厚度：0.127mm/0.203mm
阻燃等級：V-O
連續(xù)使用溫度：-40℃+125℃
絕緣擊穿電壓：4000V/6000V
高粘結(jié)強度環(huán)氧樹脂和金屬的最佳
雙面壓敏膠帶
高性能，熱傳導(dǎo)壓克力膠
熱固化粘合劑更劃算，螺釘安裝或夾安裝
Bond-Ply 800導(dǎo)熱雙面膠帶，電隔離。Bond-Ply 800用于照明應(yīng)用需要熱傳遞和電氣隔離，高粘結(jié)強度，在生產(chǎn)環(huán)節(jié)上獲得顯著節(jié)省成本，加工材料和大批量生產(chǎn)由于機械緊固件和高溫固化的消除。
典型的應(yīng)用包括 ：安裝LED裝配槽殼.安裝LED組件的散熱片.安裝散熱器上的功率轉(zhuǎn)換器的PCB或到電機控制板.安裝散熱器BGA圖形處理器或驅(qū)動處理器
性能：配置可用
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Property
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Imperial Value
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Metric Value
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Test Method
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Color
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Gray
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Gray
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Visual
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Reinforcement Carrier
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Fiberglass
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Fiberglass
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***
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Thickness (inch) / (mm)
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0.005, 0.008
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0.127, 0.203
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ASTM D374
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Elongation (%, 45° to Warp & Fill)
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70
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70
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ASTM D412
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Tensile Strength (psi) / (MPa)
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1500
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10
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ASTM D412
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CTE (μm/m-°C), -40°C to +125°C
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600
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600
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ASTM D3386
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Continuous Use Temp (°F) / (°C)
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-40 to 257
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-40 to 125
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***
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Adhesion
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Lap Shear @ RT (psi) / (MPa) (1)
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150
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1.0
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ASTM D1002
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Electrical
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Value
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Test Method
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Dielectric Breakdown Voltage (Vac), 0.005
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4000
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ASTM D149
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Dielectric Breadkown Voltage (Vac), 0.008
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6000
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ASTM D149
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Dielectric Constant (1000 Hz)
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4.0
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ASTM D150
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Volume Resistivity (Ohm-meter)
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1011
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ASTM D257
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Flame Rating
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V-O
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U.L. 94
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Thermal
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Thermal Conductivity (W/m-K)
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0.8
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ASTM D5470
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Thermal Performance vs Pressure
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Initial Assembly Pressure (psi for 5 seconds)
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10
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25
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50
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100
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200
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TO-220 Thermal Performance (°C/W), 0.005
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5.0
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5.0
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4.8
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4.3
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4.2
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TO-220 Thermal Performance (°C/W), 0.008
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6.2
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6.0
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5.6
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5.3
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5.2
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Thermal Impedance (°C-in2/W), 0.005 (2)
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0.63
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0.62
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0.60
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0.58
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0.57
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Thermal Impedance (°C-in2/W), 0.008 (2)
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0.78
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0.74
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0.72
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0.71
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0.71
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1) Tested per ASTM D1002 with aluminum lap shear samples, 75 psi applied for 5 seconds then pressure removed. 0.5 square inch Bond-Ply 800 sample.
2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
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