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貝格斯 Gap Pad EMI 1.0

特點和優點

導熱系數：1.0W

熱阻抗：1.25℃-in2/W(@30psi)

墊片材料厚度：0.508mm/3.175mm

阻燃等級：V-O

連續使用溫度：-60℃+200℃

絕緣擊穿電壓：﹥1700V

電磁干擾（EMI）吸收

低硬度

玻璃纖維增強穿刺、剪切和撕裂

電隔離

典型的應用包括 ：電子消費品.ASIC和DSP.電信.個人電腦應用

性能：

配置可用

• 表格形式
• 模切零件

 

 

Typical Properties of Gap Pad EMI 1.0
Property	Imperial Value	Metric Value	Test Method
Color	Black	Black	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	***
Thickness (inch) / (mm)	0.020 to 0.125	0.508 to 3.175	ASTM D374
Inherent Surface Tack	1	1	***
Density (Bulk Rubber) (g/cc)	2.4	2.4	ASTM D792
Heat Capacity (J/g-K)	1.3	1.3	ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)	5	5	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	10	69	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	***
Electrical
Dielectric Breakdown Voltage (Vac)	>1700	>1700	ASTM D149
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ohm-meter)	1010	1010	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
Thermal
Thermal Conductivity (W/m-K)	1.0	1.0	ASTM D5470

Thermal Performance vs. Strain
Deflection (% strain)	10	20	30
Thermal Impedance (°C-in2/W) 0.040" (3)	1.53	1.40	1.25

EMI Performance (ASTM D-5568-01 TEST METHOD)
Absorption (4)	dB/inch	dB/cm
@2.4 GHz	-7	-2.8
@5 GHz	-14	-5.5
1) Thirty second delay value Shore 00 hardness scale. 2) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. Relaxation stress @ 40 mil. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 4) Based on waveguide testing with 60 mil thickness testing.