貝格斯 Liqui-Bond SA 3505
特點和優點
導熱系數：3.5W
阻燃等級：V-O
連續使用溫度：-60℃+200℃
不需要機械緊固件
室溫儲存
保持結構的粘貼在惡劣環境中的應用
熱固化
Liqui-Bond SA 3505是一種高性能、導熱液體粘合劑。這種材料為兩部分的材料和不需要冷藏。
混合材料可在常溫和加溫固化。固化后Liqui-Bond SA 3505提供了一個強有力的結合，形成在地方彈性體。材料的彈性性能，協助緩解輕度熱循環過程中的熱膨脹系數的應力。
分配液體熱材料厚度變化提供攝錄和傳授沒有應力敏感元件在裝配。Liqui-Bond SA 3505可提供可選的玻璃間隔珠提供一個一致的鍵合線和保證介質的完整性。
典型的應用包括
· 電力供應
·分立元件的散熱器
·PCBA的住房
性能：
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Property
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Imperial Value
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Metric Value
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Test Method
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Color / Part A
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Brown
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Brown
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Visual
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Color / Part B
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Light Gray
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Light Gray
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Visual
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Viscosity / Part A, High Shear (Pa-s) (1)
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45
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45
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ASTM D5099
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Viscosity / Part B, High Shear (Pa-s) (1)
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30
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30
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ASTM D5099
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Density (g/cc)
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2.9
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2.9
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ASTM D792
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Shelf Life @ 25oC (months)
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6
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6
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***
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Property As Cured
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Color
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Light Brown
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Light Brown
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Visual
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Hardness (Shore A) (2)
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90
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90
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ASTM D2240
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Continuous Use Temp (oF) / (oC)
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-76 to 392
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-60 to 200
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***
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Shear Strength (psi) / (MPa)
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450
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3.15
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ASTM D1002
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Electrical As Cured
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Dielectric Strength (V/mil) / (V/mm)
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250
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10,000
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ASTM D149
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Dielectric Constant (1000 Hz)
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6.9
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6.9
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ASTM D150
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Volume Resistivity (Ohm-meter)
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1010
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1010
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ASTM D257
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Flame Rating
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V-O
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V-O
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U.L. 94
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Thermal As Cured
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Thermal Conductivity (W/m-K)
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3.5
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3.5
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ASTM D5470
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Cure Schedule
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Pot Life @ 25oC (3)
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240 min (4 hr)
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240 min (4 hr)
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***
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Cure @ 125oC (min) (4)
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20
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20
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***
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Cure @ 150oC (min) (4)
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10
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10
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***
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1) Capillary Viscosity, 600/sec, Part A and B measured separately.
2) Thirty second delay value Shore A hardness scale.
3) Based on 1?8" diameter bead.
4) Cure schedule – time after cure temperature is achieved at the interface. Ramp time is application dependent.
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