貝格斯 Gap Filler 1400SL

特點和好處

導熱系數：  1.8W

硬度:(Shore00) 40

阻燃等級：  V-O

連續使用溫度： -60℃+200℃

介電強度：(V/mil) 2500V

自動流平

非常柔軟

振動阻尼

Gap Filler 1400SL液體空隙填充材料擁有熱傳導和硅基材料特點。這種材料擁有非常低的粘度，從而使得其會自動流平和自動填充空隙，導致熱傳導更佳。液體材料能夠滿足各種不同的間隙形狀厚度，而且在位移時應力極小，可以解決個別應用中對界面材料厚度和形狀的需求。Gap Filler 1400SL間隙填充導熱材料應用于不需要牢固粘接結構的熱傳導界面。

典型的應用包括：汽車電子.電信.封裝半導體和磁性元件與散熱片.有機硅敏感應用.照明.電力供應

性能：

配置可用

• 可在1200包秩序和7加侖桶的格式

 

 

Typical Properties of Gap Filler 1400SL
Property	Imperial Value	Metric Value	Test Method
Color / Part A	Yellow	Yellow	Visual
Color / Part B	White	White	Visual
Viscosity, As Mixed (cps) (1)	5000	5000	ASTM D2196
Density (g/cc)	2.5	2.5	ASTM D792
Mix Ratio	1:1	1:1	***
Shelf Life @ 25oC (months)	6	6	***
Property As Cured
Color	Yellow	Yellow	Visual
Hardness (Shore 00) (3)	40	40	ASTM D2240
Heat Capacity (J/g-K)	0.9	0.9	ASTM D1269
Siloxane Content (ppm)	40	40	***
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	***
Electrical As Cured
Dielectric Strength (V/mil)	250	250	ASTM D149
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ohm-meter)	1011	1011	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
Thermal As Cured
Thermal Conductivity (W/m-K)	1.4	1.4	ASTM D5470
CURE SCHEDULE
Working Time @ 25oC (min) (4)	120 min	120 min	***
Cure @ 25oC (hrs) (4)	24	24	***
Cure @ 100oC (min) (4)	30	30	***
1) Brookfield Rheometer, Part A and Part B mixed 1:1 ratio. 2) See application note for storage and handling recommendations. 3) Thirty second delay value, Shore 00 scale. 4) Parallel Plate Rheometer, see reactivity application note.