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貝格斯 Gap Pad HC 3.0

產品分類：導熱材料

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貝格斯 Gap Pad HC 3.0特點和優(yōu)點

導熱系數： 3.0W
熱阻抗： 0.44℃-in2/W(@30psi)

墊片材料厚度： 0.508mm-3.175mm

阻燃等級： V-O

連續(xù)使用溫度： ?60℃+200℃

絕緣擊穿電壓： ﹥5000V

高度整合、低壓縮應力

玻璃纖維增強的抗剪、抗撕裂

Gappad HC 3.0是一種柔軟的間隙填充材料額定的熱傳導率為3 W/m·K材料提供出色的熱性能在較低的壓力，

由于一個獨特3 W/m填料包和低模量樹脂配方。增強材料非常適合高性能應用和要求低的裝配應力。

典型的應用包括：電信.電子消費品.ASIC和DSP.散熱片散熱片

性能：

配置可用

Typical Properties of Gap Pad HC 3.0
Property	Imperial Value	Metric Value	Test Method
Color	Blue	Blue	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	***
Thickness (inch) / (mm)	0.020 to 0.125	0.508 to 3.175	ASTM D374
Inherent Surface Tack	2	2	***
Density (Bulk Rubber) (g/cc)	3.1	3.1	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (4)	15	15	ASTM D2240
Young's Modulus (psi) / (kPa) (1)	16	110	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	***
Electrical
Dielectric Breakdown Voltage (Vac)	>5000	>5000	ASTM D149
Dielectric Constant (1 Mhz) (3)	6.5	6.5	ASTM D150
Volume Resistivity (Ohm-meter)	1010	1010	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
Thermal
Thermal Conductivity (W/m-K) (3)	3.0	3.0	ASTM D5470

Thermal Performance vs. Strain
Deflection (% strain)	10	20	30
Thermal Impedance (°C-in2/W) 0.040" (2)	0.57	0.49	0.44
1) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2 after 5 minutes of compression at 10% strain on a 1mm thickness material. 2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 3) Minimum value at 20 mil. 4) Thirty second delay value on Shore 00 hardness scale.